0,15 MM EMMC EMCP UFS Reballing jig Platform BGA153 BGA162 BGA169 BGA254 BGA221 BGA186 Reballing Stencil Plante Tin Stål Net
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kr74.58
kr118.37
-36%
Tags: emmc, glæde con metal, kit lodde, bga stencil, emmc ic reballing, bærbar stencil, bga emmc stencil, bga153 stencil, bga rebal, drum kyocera m3040.
0,15 MM EMMC EMCP UFS Reballing jig Platform BGA153 BGA162 BGA169 BGA254 BGA221 BGA186 Reballing Stencil Plante Tin Stål Net
Pakke | taske |
Oprindelse | KN(Oprindelse) |
Model-Nummer | EMMC EMCP UFS Universal Lodning jig Platform |
Type | EMMC/EMCP/UFS Reballing jig platform |
Application1 | Mobiltelefon EMMC EMCP BGA reparation |
Mærke | TOOKKS |
DIY-Forsyninger | ELEKTRISK |
Model | |
Anvendelse | Edb-Værktøj |
Application2 | Computer reparation kit |