0,15 MM EMMC EMCP UFS Reballing jig Platform BGA153 BGA162 BGA169 BGA254 BGA221 BGA186 Reballing Stencil Plante Tin Stål Net


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Tags: emmc, glæde con metal, kit lodde, bga stencil, emmc ic reballing, bærbar stencil, bga emmc stencil, bga153 stencil, bga rebal, drum kyocera m3040.

0,15 MM EMMC EMCP UFS Reballing jig Platform BGA153 BGA162 BGA169 BGA254 BGA221 BGA186 Reballing Stencil Plante Tin Stål Net

Pakke taske
Oprindelse KN(Oprindelse)
Model-Nummer EMMC EMCP UFS Universal Lodning jig Platform
Type EMMC/EMCP/UFS Reballing jig platform
Application1 Mobiltelefon EMMC EMCP BGA reparation
Mærke TOOKKS
DIY-Forsyninger ELEKTRISK
Model
Anvendelse Edb-Værktøj
Application2 Computer reparation kit

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0,15 MM EMMC EMCP UFS Reballing jig Platform BGA153 BGA162 BGA169 BGA254 BGA221 BGA186 Reballing Stencil Plante Tin Stål Net

0,15 MM EMMC EMCP UFS Reballing jig Platform BGA153 BGA162 BGA169 BGA254 BGA221 BGA186 Reballing Stencil Plante Tin Stål Net

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