Amaoe BGA Reballing Stencil For Qualcomm CPU RAM Chip IC SDM710 SM6150 MSM8917 SDM845 SM8150 SDM670 BGA Reballing Skabelon


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Amaoe BGA Reballing Stencil For Qualcomm CPU RAM Chip IC SDM710 SM6150 MSM8917 SDM845 SM8150 SDM670 BGA Reballing Skabelon

Tykkelse 0,12 mm
Materiale Rustfrit Stål
Type Andre
Model-Nummer Amaoe BGA Reballing Stencil
Brug Kommerciel Fremstilling

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Amaoe BGA Reballing Stencil For Qualcomm CPU RAM Chip IC SDM710 SM6150 MSM8917 SDM845 SM8150 SDM670 BGA Reballing Skabelon

Amaoe BGA Reballing Stencil For Qualcomm CPU RAM Chip IC SDM710 SM6150 MSM8917 SDM845 SM8150 SDM670 BGA Reballing Skabelon

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