Amaoe BGA Reballing Stencil For Qualcomm CPU RAM Chip IC SDM710 SM6150 MSM8917 SDM845 SM8150 SDM670 BGA Reballing Skabelon
Ny vare
kr25.48
kr37.44
-31%
Tags: stencil qualcomm, telefonen xaiomi, lenovo z, 50 skærmen, qianli stencil, android globale, lg 845 snapdragon, snapdragon 845 udgave, bga stencil sdm845, vs995.
Amaoe BGA Reballing Stencil For Qualcomm CPU RAM Chip IC SDM710 SM6150 MSM8917 SDM845 SM8150 SDM670 BGA Reballing Skabelon
Tykkelse | 0,12 mm |
Materiale | Rustfrit Stål |
Type | Andre |
Model-Nummer | Amaoe BGA Reballing Stencil |
Brug | Kommerciel Fremstilling |