Intel Xeon E3-1235 E3 1235 3,2 GHz Quad-Core CPU Processor 6M 95W LGA 1155

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Intel Xeon E3-1235 specifications

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General information Type Market segment Server Family Model number E3-1235 CPU part numbers CM8062307262206 is an OEM/tray microprocessor BX80623E31235 is a boxed microprocessor Frequency 3200 MHz Maximum turbo frequency 3600 MHz (1 core)

3500 MHz (2 cores)

3400 MHz (3 cores)

3300 MHz (4 cores) Bus speed 5 GT/s DMI Clock multiplier 32 Package 1155-land Flip-Chip Land Grid Array (FCLGA 1155) Socket Socket 1155 / H2 / LGA1155 Size 1.48" x 1.48" / 3.75cm x 3.75cm Introduction date End-of-Life date Last order date is December 27, 2013

Last shipment date for tray processors is December 5, 2014 Price at introduction $240 S-spec numbers Part number ES/QS processors Production processors BX80623E31235 + CM8062307262206 + + Architecture / Microarchitecture Microarchitecture Sandy Bridge Platform Bromolow Processor core Core stepping D2 (SR00J) CPUID 206A7 (SR00J) Manufacturing process 0.032 micron High-K metal gate process Data width 64 bit The number of CPU cores 4 The number of threads 8 Floating Point Unit Integrated Level 1 cache size 4 x 32 KB 8-way set associative instruction caches

4 x 32 KB 8-way set associative data caches Level 2 cache size 4 x 256 KB 8-way set associative caches Level 3 cache size 8 MB 16-way set associative shared cache Physical memory 32 GB Multiprocessing Uniprocessor Features MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 AES / Advanced Encryption Standard instructions AVX / Advanced Vector Extensions EM64T / Extended Memory 64 technology / Intel 64 NX / XD / Execute disable bit VT-x / Virtualization technology VT-d / Virtualization for directed I/O TBT 2.0 / Turbo Boost technology 2.0 TXT / Trusted Execution technology HT / Hyper-Threading technology Low power features C1, C3 and C6 thread states C1/C1E, C3 and C6 core states C1/C1E, C3 and C6 package states Enhanced SpeedStep technology Integrated peripherals / components Integrated graphics GPU Type: HD P3000

Microarchitecture: Gen 6

Execution units: 12

Base frequency (MHz): 850

Maximum frequency (MHz): 1350

The number of supported displays: 2 Memory controller The number of controllers: 1

Memory channels: 2

Supported memory: DDR3-1066, DDR3-1333

Maximum memory bandwidth (GB/s): 21.3

ECC supported: Yes Other peripherals Direct Media Interface 2.0 PCI Express 2.0 interface Electrical / Thermal parameters Minimum/Maximum operating temperature 5°C - 72.6°C Minimum power dissipation 5.5 Watt (C6 state) Thermal Design Power 95 Watt