Amaoe BGA Reballing Stencil FOR Qualcomm SDM710 SDM845 SDM660 SDM636 MTK MT6771V MT6739V MT6763V MT6757V CPU Reballing Tin


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kr32.40

kr39.50

-17%



Tags: amaoe telefon, amao stencil, sdm660, tablet pc mtk cpu, LEAGOO, bga cpu, android mobil telefon, snaodragon 845, 5 power, stencil xiaomi.

Produkt Introduktion:

Amaoe BGA Reballing Stencil FOR Qualcomm SDM710 SDM845 SDM660 SDM636 MTK MT6771V MT6739V MT6763V MT6757V CPU Reballing Tin

Package:

1 x Rebaling Stencil Skabelon

Type Andre
Materiale Rustfrit Stål
Tykkelse 0,12 mm
Model-Nummer Amaoe BGA Reballing Stencil
Brug Kommerciel Fremstilling

Skriv en anmeldelse

Amaoe BGA Reballing Stencil FOR Qualcomm SDM710 SDM845 SDM660 SDM636 MTK MT6771V MT6739V MT6763V MT6757V CPU Reballing Tin

Amaoe BGA Reballing Stencil FOR Qualcomm SDM710 SDM845 SDM660 SDM636 MTK MT6771V MT6739V MT6763V MT6757V CPU Reballing Tin

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