Amaoe BGA Reballing Stencil FOR Qualcomm SDM710 SDM845 SDM660 SDM636 MTK MT6771V MT6739V MT6763V MT6757V CPU Reballing Tin
Ny vare
kr32.40
kr39.50
-17%
Tags: amaoe telefon, amao stencil, sdm660, tablet pc mtk cpu, LEAGOO, bga cpu, android mobil telefon, snaodragon 845, 5 power, stencil xiaomi.
Produkt Introduktion:
Amaoe BGA Reballing Stencil FOR Qualcomm SDM710 SDM845 SDM660 SDM636 MTK MT6771V MT6739V MT6763V MT6757V CPU Reballing Tin
Package:
1 x Rebaling Stencil Skabelon
Type | Andre |
Materiale | Rustfrit Stål |
Tykkelse | 0,12 mm |
Model-Nummer | Amaoe BGA Reballing Stencil |
Brug | Kommerciel Fremstilling |